Application:
Adhensive&Fixing Glue、Silicone Potting 、Covering Adhesive、Silicone Gel、Three-Phase Conformal Coating、Thermal Gel and Glue。
High pressure IGBT module high temperature encapsulation silicon gel, medium and low pressure IGBT module
encapsulation silicon gel
Chip pin, IC pin and integrated circuit board solder joint protection adhesive
Chip passivation protection adhesive, diode-triode insulation protection,
New energy vehicle reversing radar, sensors, controllers and other bonding seals,
Thermal gel for new energy automotive electronics and 5G communication products
New energy car charger, charging pile high thermal conductivity two-component potting glue
CIPG, FIPG process free gasket one component plus forming sealant
Solvent-free three anti-paint, PCB surface coating, photovoltaic inverter and other low stress potting, thermal potting
Mobile phone adapters and other consumer electronics high thermal conductivity fixing adhesive, electronic
components fixing adhesive
LED bulb lamp, street lamp, decorative lamp and other heat conduction, filling, bonding
High power LED drive power supply heat conduction, filling, bonding
New energy vehicle battery module potting, sealing, high thermal grease
QQ:
手机:0086-136 0286 9588
电话: 0086-20-2262-5106
邮箱: tina.dai@lettersemi.com
地址:RM708 Innovation Building,Tian An Technology Park, Ying Bin Road, Panyu Zone, Guangzhou City,China